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NUANCE: Nanoscale Characterization Experimental Center

Laser Cutter – LPKF ProtoLaser R

LPKF Protolaser R is a full-scale production level CNC laser cutter which can be used to cut or ablate materials such as PCBs, Si wafers, glass, metals and polymers such as PDMS and Polyimide. Its picosecond laser ablates materials with virtually no heat input. It practically eliminates heat transfer; the targeted material evaporates immediately minimizing the damage to the surrounding material. This allows even complex thin film systems, temperature-sensitive substrates, and OLED coatings on glass to be ablated or structured with a high degree of control. The laser system requires no masks or films to accomplish these tasks.

Instrument Details