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NUANCE: Nanoscale Characterization Experimental Center

Ball Wire Bonder – IBond5000

The iBond 5000 is a ball bonder for making electrical interconnections between a chip and the package. Ball bonding processes use a combination of heat, pressure, and ultrasonic energy to make a weld at each end of the wire. This wire bonder is set up to use gold wire with a diameter of 25 mm and works on gold as well as other metallic pads.

Instrument Details