Features
- A precision machine to cut semiconductor wafers into individual chips or dies.
- Capable of perpendicular dicing of thin Substrates up to 8” (or random sizes)
- Substrates: Silicon, Glass, Quartz, PZT, MgO, Thick-film Devices
- PC operated, standard and programmable recipes for specific dicing needs.
- User-friendly graphical user interface, precise XY/theta movement, digital camera with LED illumination, continuous digital magnification
- Wafer Mounting Unit-DS966 (ADT): Mounting of up to 8” Samples on dicing tape and frame.
Substrate vacuum and heating available
