Features Wafer size: up to 200 mm Turbo pump backed by a dry roughing pump RF Power: 13.56 MHz, 300 W Six gas lines: CF4, CHF3, SF6, O2 (20 sccm), O2 (200 sccm), Ar/N2
Facility ContactMain Contact: Anil Dhote,PhDOffice: Cook Hall, 4087(847) 467-2066 / emailAlternate Contact: Dr. Nasir Basit847-467-6201 / email