Features Wafer size: 100 mm Bosch Process License Pegasus Source with 3kW RF Generator Gases: C4F8, SF6, O2, and Ar Processes: Smooth Sidewall (roughness<50 nm), Small Trench (2-3 micron), and Fast Etch Rate (>15 micron/min)
Facility ContactMain Contact: Shaoning Lu, PhDOffice: Tech, #FG71(847) 491-3853 / email Alternate Contact: Dr. Nasir Basit(847)-467-6201 / email