Features Substrate size: Up to four 4-inch wafers Fast pumping with cryo-pump and dry roughing pump Three shielded sources with 2 kVA power supply Substrate heating/cooling possible
Facility ContactMain Contact: Dr. Nasir BasitOffice: Tech, FG73847-467-6201 / email Alternate Contact: Anil Dhote, PhD847-491-5959 / email