Features
- The TPT HB100 Automatic Wire Bonder is ideal for specialized applications including bonding for quantum devices & devices with many repeatable bonds
- Capable of wedge, ball, ribbon, & bump bonding using Al or Au wire
- Heater stage for Au ball bonding (up to 100oC)
- Motorized X, Y, & Z Axis for fluid movement
- Ultrasonic scrubbing @ 63 kHz for optimal metal-to-metal coupling
- Can store recipes for users that require high repeatability across their devices
- Ability to copy recipes and parameters
- ion, RGA, vacuum < 2×10-9 Torr
- Automatic linear substrate transfer to and processing in all chambers through a single recipe
- Substrate size: Small chips to 4-inch diameter wafers
