Features
- Load-locked ultrahigh vacuum (UHV) sputter system with vacuum in 10-9 Torr range for deposition of films for quantum devices
- One 6″ and two 3″ diameter sputter guns
- Substrate holders for accommodating small chips up to 6” diameter wafers
- Substrate heating up to 1000 oC
- DC and HiPIMS power supplies
- Substrate rotation
- Z-axis motion for adjusting source substrate distance
- Substrate bias for cleaning or assisting deposition
- Load-lock with turbo pump backed by a dry roughing pump
- Cryo pump for main chamber
